ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,541, issued on Dec. 16, was assigned to RHODIA OPERATIONS (Lyons, France). "Liquid dispersion and powder of cerium based core-shell particl... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,683, issued on Dec. 16, was assigned to Micron Technology Inc. (Boise, Idaho). "Methods of forming conductive pipes between neighboring fea... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. D1,105,802, issued on Dec. 16, was assigned to YY VERTICAL (Saint Vincent de Mercuze, France). "Board for hanging keys" was invented by Cheng Yang... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,226, issued on Dec. 16, was assigned to ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE (Daejeon, South Korea). "Method and apparatus... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,499,987, issued on Dec. 16, was assigned to Invoy Holdings Inc. (Aliso Viejo, Calif.). "Health monitoring and coaching system" was invented by ... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,925, issued on Dec. 16, was assigned to Texas Instruments Inc. (Dallas). "Register file structures combining vector and scalar data with gl... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,016, issued on Dec. 16, was assigned to Hilti AG (Schaan, Liechtenstein). "Wire loop hoist point anchor" was invented by Marco Sanchez Lope... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,837, issued on Dec. 16, was assigned to Halliburton Energy Services Inc. (Houston). "Lateral access control in downhole window joints" was ... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,469, issued on Dec. 16, was assigned to FUJIFILM Corp. (Tokyo). "Composition for forming pattern, kit, pattern producing method, pattern, a... Read More
ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,201, issued on Dec. 16, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor element bonding substrate, semiconductor device, ... Read More